Protección contra la corrosión de electrorrecubrimientos níquel/cobre utilizando la técnica PRC

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Autores

William Aperador, Dionisio Laverde, Enrique Vera y Javier Guerrero

Abstract

Se presenta la implementación de la técnica de corriente pulsante inversa para electrodepositar películas delgadas de Cu-Ni en forma de bicapa sobre sustratos de zamac, controlando  los  voltajes  y  tiempos  de  electrodepósitos anódicos (Vlow, TLow) y catódicos (VHight, THight) y obteniendo como respuesta el monitoreo de la corriente anódica (ILow) y catódica (IHight) en función del tiempo anódico (TLow) y catódico (THight) respectivamente. Se obtuvieron películas de Cu (electrolitos cianurados) y Ni (electroli tos  ácidos)  con  espesores  entre  18  y  62 micrómetros. Se observó, mediante microscopía de fuerza atómica (AFM), que el control pulsante del voltaje durante el depósito permite obtener películas de Cu/Ni más densas y de mejor granulometría que las películas convencionales depositadas  por  la  técnica  de  corriente  directa.  Se determinó la composición química de las capas usando la sonda  de  difracción  de  rayos X  (EDX),  además,  se realizaron medidas de brillo y microdureza vickers de la
última capa, correspondiente al níquel.

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