Effect of copper-enriched layers on localized corrosion of aluminium-copper alloys

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Published May 15, 2018
https://doi.org/10.19053/01211129.v27.n48.2018.8016
Section: PAPERS
Issue: Vol 27 No 48 (2018)
How to Cite
Arenas-Vara, M., Skeldon, P., & García-Vergara, S. (2018). Effect of copper-enriched layers on localized corrosion of aluminium-copper alloys. Revista Facultad De Ingeniería, 27(48), 7-15. https://doi.org/10.19053/01211129.v27.n48.2018.8016
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Autores

María Ángeles Arenas-Vara
Ph.D. Centro Nacional de Investigaciones Metalúrgicas – CENIM (Madrid, España)., Spain.

Peter Skeldon
Ph.D. University of Manchester (Manchester, Reino Unido)., United Kingdom.

Sandra Judith García-Vergara
Ph.D. Universidad Industrial de Santander (Bucaramanga-Santander, Colombia)., Colombia.

Abstract

Copper-enriched layers were developed onto aluminum-copper alloys using alkaline etching in sodium hydroxide, for both, sputter deposited and bulk conditions. Enriched alloys were evaluated by potentiodynamic polarization in sodium chloride solution in order to determine the effect of the enriched layers on the pitting potential of the alloys. Rutherford backscattering spectroscopy was employed to quantify the enrichments and their locations just beneath the alumina-based oxides remaining from the etching. For the sputter deposited aluminum-copper alloys, the results show some scattering of the pitting potential data, and no correlation between pitting potential and the alloy enriched layer. In the case of bulk Al-2wt.%Cu alloy, with the copper in solid-solution, the pitting potential increased for the enriched specimens, indicating also a different pit morphology, with respect to the non-enriched alloy.

Keywords:

aluminium-copper alloys
anodizing
copper enrichment
pitting

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