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Vol. 18 No. 2 (2018)
Ingeniería, Investigación y Desarrollo

ARTICULOS DE INVESTIGACION

Lixiviation of copper content in pcb computer cards for the extraction of precious metals

https://doi.org/10.19053/1900771X.v18.n2.2018.11873

Published 2018-07-01

  • Ginna Alejandra Jiménez Tovar
    • ,
  • Mario Parra Pinilla

Ginna Alejandra Jiménez Tovar
Universidad Pedagógica y Tecnológica de Colombia

Mario Parra Pinilla
Universidad Pedagógica y Tecnológica de Colombia

Abstract

The recovery of gold and silver from electronic waste is a friendly alternative to the environment that can complement the industrial production of them, usually obtained from natural ores and also to promote the reduction of such waste1. As a step prior to the recovery of these metals it is necessary to extract the copper contained in them and thus achieve a greater recovery. In the present study, the extraction2 of copper was analyzed from PCB computer cards. It began with a characterization of the metals of interest to then study their behavior in the dissolution process. Next, a process of leaching with inorganic acids was carried out at ambient conditions for six hours and mechanical agitation of 300 RPM. At the end, leaching was chosen with the highest percentage of copper extracted and a characterization of the waste was made showing that the copper content decreased from 27.09% to 1.48%. Likewise, the concentration of gold varied from 131.29 g / ton to 345.9 g / ton and that of silver from 310 g / ton to 864.8 g / ton. To verify the copper cleaning process, a leaching process was carried out with thiourea solutions, obtaining results of 74.79% and 64.8% for silver and gold, respectively.

Keywords

inorganic acid, copper, cleaning, leaching, PCB

Supplementary File(s)

pdf (Español)

References

  1. R. Cayumil, R. Khanna, R. Rajarao, P.S. Mukherjee, V. Sahajwalla, “Concentration of precious metals during their recovery from electronic waste”, Waste Management, vol. 57, pp 121-130, 2016. DOI: http://dx.doi.org/10.1016/j.wasman.2015.12.004 DOI: https://doi.org/10.1016/j.wasman.2015.12.004
  2. Este año Colombia tendrá 143.000 toneladas de residuos electrónicos. [En línea]. El Tiempo. Bogotá D.C. 28, agosto, 2015. [Consulta: enero 2015]. Mensaje archivado en http://www.eltiempo.com/archivo/documento/CMS-13156235.
  3. El planeta tiro a la basura 180 billones de pesos. [En línea]. El Espectador. Bogotá D.C. 14, diciembre, 2017. [Consulta: mayo 2018]. Mensaje archivado en https://www.elespectador.com/noticias/medio-ambiente/el-planeta-tiro-la-basura-180-billones-de-pesos-articulo-728484.
  4. Y. Reyes, I. Vergara, O. Torres, M. Diaz-Lagos, E.E. González-Jimenez, “Contaminación por metales pesados: Implicaciones en salud, ambiente y seguridad alimentaria”, Revista Ingeniería Investigación y Desarrollo, vol. 16 (2), pp. 66-77, julio, 2016. DOI: https://doi.org/10.19053/1900771X.v16.n2.2016.5447 DOI: https://doi.org/10.19053/1900771X.v16.n2.2016.5447
  5. J. Huang, M. Chen, H. Chen, S. Chen, Q. Sun, “Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid”, Waste Management, vol. 34, pp. 483-388, 2014. DOI:http://dx.doi.org/10.1016/j.wasman.2013.10.027. DOI: https://doi.org/10.1016/j.wasman.2013.10.027
  6. S. Yousef, M. Tatariants, R. Bendikiene, G. Denafas,“Mechanical and thermal characterizations of non-metallic components recycled from waste printed circuit boards”, Journal of Cleaner Production, vol. 167, pp. 271-280, 2017. DOI: http://dx.doi.org/10.1016/j.jclepro.2017.08.195. DOI: https://doi.org/10.1016/j.jclepro.2017.08.195
  7. A. Kumar, M. Holuszko, T. Janke, “Characterization of the non-metal fraction of the processed waste printed circuit boards”, Waste Management,vol. 75, pp. 94-108, 2018. DOI: https://doi.org/10.1016/j.wasman.2018.02.010. DOI: https://doi.org/10.1016/j.wasman.2018.02.010
  8. L. Diaz, T. Lister, “Economic evaluation of an electrochemical process for the recovery of metals from electronic waste”, Waste Management, vol. 74, pp. 384-392, 2018. DOI:https://doi.org/10.1016/j. wasman.2017.11.050 DOI: https://doi.org/10.1016/j.wasman.2017.11.050
  9. H. Lee, B. Mishra, “Selective recovery and separation of copper and iron from fine materials of electronic waste processing”, Minerals Engineering, vol. 123, pp. 1-7, 2018. DOI: https://doi.org/10.1016/j.mineng.2018.04.021 DOI: https://doi.org/10.1016/j.mineng.2018.04.021
  10. S. Fogarasi, F. Imre-lucaci, Á. Imre-lucaci, P. Ilea,“Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidations”, Journal of Hazardous Materials, pp 215-221, 2014. DOI: http://dx.doi.org/10.1016/j.jhazmat.2014.03.043. DOI: https://doi.org/10.1016/j.jhazmat.2014.03.043
  11. Y. Lu, Z. Xu, “Precious metals recovery from waste printed circuit boards: A review for current status and perspective”, Resources, Conservation and Recycling, vol. 113, pp. 28-39, 2016. DOI: http://dx.doi.org/10.1016/j.resconrec.2016.05.007. DOI: https://doi.org/10.1016/j.resconrec.2016.05.007
  12. M. Parra. “Los diagramas de Pourbaix” en Universidad Pedagógica y Tecnológica de Colombia, 1989, pp. 1-4.
  13. NIST, 2004. Critically Selected Stability Constants of Metal Complexes. NIST Standard Reference Database 46, Version 8.0.
  14. Robinson Torres, Gretchen T. Lapidus. “Copper leaching from electronic waste for the improvement of gold recycling”, Waste Management, vol. 57, November 2016. pp 131 – 139. DOI:http://dx.doi.org/10.1016/j.wasman.2016.03.010 DOI: https://doi.org/10.1016/j.wasman.2016.03.010
  15. Base de datos plataforma HSC CHEMISTRY 5.11 forWindows.
  16. I. Birloaga, I. Michelis, F. Ferella, M. Buzatu, F. Veglio, “Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery”, Waste Management, vol. pp 935-941, 2013. DOI: http://dx.doi.org/10.1016/j.wasman.2013.01.003 DOI: https://doi.org/10.1016/j.wasman.2013.01.003
  17. E.Y. Yacizi, H. Deveci, “Ferric sulphate leaching of metals from waste printed circuit boards”, International Journal of Mineral Processing, vol. 133, pp. 39-45,2014. DOI: http://dx.doi.org/10.1016/j.minpro.2014.09.015. DOI: https://doi.org/10.1016/j.minpro.2014.09.015

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